Low Power Ethernet Coming

September 20, 2010

Representatives of technology firms such as Broadcom, Cisco Systems and others are expected to ratify a low-power Ethernet standard that could cut energy use 60 percent or more in basic networking functions.

The ratification of 802.3az is anticipated on Sept. 30 after four years of work, says Wael William Diab, a technical director at Broadcom and vice-chair of the IEEE 802.3 Ethernet working group. The standard will allow chip and gear makers to put physical layer, or PHY, circuits into a sleep mode during the microseconds between packet transmissions.

Physical layer connections are the most basic in networking equipment, primarily handling the streaming of raw digital “bits” among devices. Diab said the introduction of a PHY-level idle mode should enable equipment makers to simultaneously turn off other parts of a router, switch or gateway, leading to more power savings.

Broadcom already has pre-standard products in the market.

The challenge to completing the standard was finding an effective way to awaken gear when packet traffic resumes. The energy-saving feature will be incorporated in new, not existing, equipment.


Intel’s New Shopping Craze: Wireless Technologies For Smartphones

August 5, 2010

Remember the late 90′s, when Intel was throwing billions in its quest to become a telecommunication powerhouse, to finally write it all off?

Well, sounds that the chipmaker is at it again with the recent acquisitions of Infineon’s cellular and GPS technology as well as the assets of small 4G vendor Comsys.

Hopefully, the mastermind of Intel’s first telecom foray, Sean Maloney, might remember one or two things learned from his first failed attempt to build a communications empire!

As analyst Linley Gwennap writes it,

“Making it clear that money is no object in its quest to become a major player in the smartphone market, Intel plans to acquire the wireless operations of Infineon in a deal valued at more than $1.2 billion. Infineon’s cellular and GPS technology will complement Intel’s Atom processor and Wi-Fi expertise, allowing Intel to deliver a complete solution for the rapidly growing smartphone and tablet-computer markets.”

Infineon ranked fourth in cellular-baseband shipments last year with 10.7% unit share, according to a recent report from The Linley Group. Infineon is a major supplier to Apple, Nokia, and Samsung.

But “the German vendor lacks an application processor, however, making success in the smartphone market difficult, and it has struggled to sell its 3G baseband outside of Apple,” adds Linley.

The analyst adds that in a quieter but significant move, Comsys acquisitions brings a processor for WiMax phones and was working on converting that design to support LTE.

Intel’s secret goal (well not anymore!) is to merge Infineon and Comsys technologies to create its own 4G solution coupled to its Atom chip for smartphones.

“Intel is clearly focused on smartphones, leaving the future of Infineon’s popular 2G processors in doubt. This deal could end up helping vendors such as Broadcom, MediaTek, and ST-Ericsson, which could step into the breach with their own 2G processors. Conversely, the deal gives Intel the technology it needs to develop an integrated 3G-smartphone processor, allowing it to compete against vendors such as Qualcomm and Marvell,” says Linley.

First published in TechPulse 360.


High Speed Gear To See Sales Boost Even As Networking Market Stumbles

March 20, 2009

Networking equipment sales to service providers and businesses will fall 10 percent in 2009.

But high-performance gear capable to 10 Gbps and 40 Gbps second speeds will buck the trend and rise, Dell’Oro Group says.

40 Gbps equipment is one bright spot

40 Gbps equipment is one bright spot

Switches and routers with 10 Gbps performance is seeing growing interest in businesses data centers and with high-demand servers.

The more potent 40 Gbps equipment is catching on with service providers in backbone router and optical transport networks.

The leaders in the market are as expected, according to Dell’Oro:

Cisco Systems hold the top spots in 10 Gbps switching and 40 Gbps routing. Nokia Siemens leads in 40 Gbps optical DWDM long-haul. And Broadcom is number one for 10 Gbps silicon controllers for servers.


Intel Still Tops Semiconductor Industry

March 12, 2009

isuppli-top-25

Intel is still by far the world’s leading chip company, representing 13.1 per cent of the semiconductor industry’s global revenue, iSuppli reports.

Far behind, is Samsung Semiconductor at 6.5 per cent, then Toshiba Semiconductor and Texas Instruments (4.3 per cent each) and ST Microelectronics (4 per cent).

According to the research firm, four of the top five vendors reported drops in revenue; only ST Micro sales rose 3.3 per cent last year.

The IC suppliers that significantly increased their revenue in 2008 were Qualcomm (+15.3 per cent), Broadcom (+23.9 per cent), Panasonic Semiconductor (+15.3 per cent), Kyoto-based Rohm (+27.2 per cent), and Taiwanese company MediaTek (+18.1 per cent).


Battle Shaping Up Among Chip Suppliers To Cell Phone Market

January 19, 2009

Leading suppliers of chips for cell phones, Texas Instruments and Qualcomm, will find their market positions increasingly precarious as consolidation continues among handset makers.

Qualcomm and Texas Instruments could see new pressures on their businesses

Qualcomm and Texas Instruments could see new pressures on their businesses

Purchasing power is shifting to phone giants Samsung and Nokia, both of which show interest in changing the way they buy semiconductors, said analysts David Eller and Caroline Gabriel at securities firm JRPG.

Samsung has begun to look at developing chips internally, which could affect its purchases from Qualcomm.

Nokia has begun shying away from customized chips and begun diversifying purchases beyond Teas instruments.

Both companies are expected to broaden their market shares, making them more influential over time, JRPG said in a research note on Monday. The impact could be felt by chip makers as soon as the first half of 2009, but more probably in 2010.

Chip manufacturers likely to benefit from the changes include Infineon, Broadcom and STMicroelectronics.


HD Television Vendors Line Up Behind Rival Wireless Standards

December 12, 2008

High-definition televisions sporting wireless connections have yet to hit most retail shelves, but vendors are tussling over standards for this latest consumer feature.

An outdoor, wireless, weatherproof TV

An outdoor, wireless, weatherproof TV

Two industry groups are lining up behind rival 5 GHz and 60 GHz technology proposals.

The 5 GHz standard is based on technology from Israeli-based Amimon, and is backed by Hitachi, Motorola, Sharp, Samsung and Sony, says ABI Research. The companies formed the WHDI Special Interest Group.

Mitsubishi, separately, has said it will use Amimon technology.

The 60 GHz approach is designed by Sunnyvale startup SiBEAM and has drawn the support of Intel, LG Electronics, Matsushita Electric, NEC and Toshiba. This WirelessHD group also claims Samsung and Sony, who are hedging their bets.

Broadcom also has joined the consortium, said ABI analyst Steve Wilson.

Amimon has shipped 100,000 of its wireless chipsets and is making “real progress promoting its solution,” says Wilson. SiBEAM, meanwhile, has a new round of fundraising and has won investments from Sony and Panasonic.

In Japan, Sharp and Hitachi are shipping high-end wireless televisions. In the U.S., Sony has its Bravia wireless adaptor available in some retail outlets, said Wilson.

Expect to see new models at January’s Consumer Electronics Show.


Virtualization Is #1 Driver For AMD Push in Server Chipset Business

September 30, 2008

Virtualization was one of the main topics discussed this morning at AMD’s “Shanghai” media briefing in San Francisco.

First, was the key issue of moving virtual machines using VMware’s VMotion administration tool between AMD and Intel servers. Unable to do so, companies will then have to decide very early on whether to choose between AMD or Intel hardware platforms.

“It’s possible but under certain conditions [AMD promised to "get back to us" with more details. Comments Margareth?]. But there are also issues in moving virtual machines from Intel to Intel servers”, said AMD’s server and workstation division general manager, Patrick Patla.

AMD’s executive also confirmed that virtualization and virtualized I/O was the #1 driver for the company’s push into the server chipset business. Effectively competing with partners like Broadcom or Nvidia that had so far supplied the chipsets for AMD’s server processors.

“Virtualization is now in our DNA and when we do silicon design or we’re thinking of enhancements we always think about what we can do for virtualization
… We need it [the chipset] to make sure that it’s done right, that we bring the feature [virtualized I/O] to market when we think it needs to be there”, explains Patla.


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